If your work involves electronics manufacturing, connector design, or quality control, the second most likely candidate is .
IEC 60352-5 is a standard that defines the requirements for solderless press-in connections used in electrical and electronic equipment. The standard provides specifications for the design, testing, and inspection of press-in connections, which are used to connect components, such as wires, cables, and printed circuit boards.
Let's examine each one in detail.
The connection must withstand push-out and pull-out forces. This ensures the connector stays attached to the board during assembly, handling, and operation. 4. Test Methods (How to Validate Compliance)
According to the official text of the 2020 edition, . A press‑in connection consists of a termination (the press‑in pin) that has a specially designed press‑in zone, which is inserted into a hole in a board. The board can be a conventional printed circuit board (PCB) — double‑sided or multilayer — but the standard recognises that press‑in terminations are increasingly being used in many non‑printed board materials as well. The 2020 edition explicitly added terms and definitions for ‘board’, ‘hole’ and ‘metal board’ to reflect this broader scope. iec 603525 pdf
The connection must exhibit low contact resistance. The standard defines maximum allowable resistance changes after environmental testing (e.g., rapid change of temperature, damp heat). C. Mechanical Strength
The IEC 60352-5 standard provides several benefits, including: Let's examine each one in detail
Offers a preview of the publication's content, including the Table of Contents and Scope.
for high-vibration environments.
: Full catalog entry for the latest edition.
: Offers best practices for repairing or replacing connections without damaging the board. iTeh Standards Summary of Advantages for Engineers Solderless process Eliminates thermal stress and solder bridges/cold joints. Environmental Friendly "Green" process that avoids lead or flux residues. Cost Efficiency Faster manufacturing process with reduced assembly time. Reliability rapid change of temperature